Medontech has emerged as a trustworthy partner to cater to their Printed Circuit Board Assembly needs for Prototype & full Production Volumes. Our unflinching commitment to quality is manifested through our continuous investments in technology and using our State- Of- the- Art PCB Assembly equipment such as high-speed pick and place machines, multi-zone reflow ovens and Technical Devices dual wave/chip solder machines.

Our Printed Circuit Board Assembly process flow:

Our assembly capabilities:

• Prototype and High volume Assembly
• ROHS Compliance Services
• BGA and Micro-BGA Capabilities

• CSP (Chip Scale Packaging)
• Flip Chip
• X-Ray Verification
• Reballing
• Rework (De-population and Re-population)

• Automated Optical Inspection
• Machine and manual soldering Options as per customer requirements
• LED and Lighting PCB Assembly
• SMT and ThroughHole Assembly
• Single, double-sided &mixed technology PCB assembly
• Cable & Harness Assembly
• Capability to handle virtually any device including all types of BGAs,CGAs,QFNs,DFNs,CSPs and SONs
• Fine pitch component assembly
• Press fit connectors
• Development of Customer specific Test jig
• Rework Capabilities

• De-population and Re-population
• Fine Pitch
• Cuts & Jumps
• Piggybacks & Teepees
• Minor PCB Repair